Samsung To Utilize chip making technology To Advance AI By CIOTechOutlook Team

Samsung To Utilize chip making technology To Advance AI

CIOTechOutlook Team | Wednesday, 13 March 2024, 04:43 IST

Samsung intends to utilize a chip-making technology supported by rival SK Hynix, five individuals said, as the world's top memory chipmaker tries to get up to speed in the competition to create very good quality chips to advance artificial intelligence.

The interest in high bandwidth memory (HBM) chips has blasted with the developing ubiquity of generative AI. Yet, Samsung, dissimilar to peers SK Hynix and Micron Innovation, has been obvious by its nonappearance in any dealmaking with I chip leader Nvidia to supply most recent HBM chips.

Samsung has fallen behind in its choice to stay with chip-making innovation called non-conductive film (NCF), which causes some creation issues, while Hynix changed to the mass reflow molded underfill (MR-MUF) technique to address NCF's shortcoming, as indicated by examiners and industry watchers. Samsung, nonetheless, has of late given orders for chipmaking equipment intended to deal with MUF method, three sources with direct information regarding this situation said.

"Samsung had to do something to ramp up its HBM (production) yields ... adopting MUF technique is a little bit of swallow-your-pride type thing for Samsung, because it ended up following the technique first used by SK Hynix," one of the sources said.

Samsung's HBM3 chip creation yields stand at around 10-20%, whereas SK Hynix has gotten around 60-70% yield rates for its HBM3 creation, as indicated by a few investigators. The HBM3 and HBM3E, the freshest variants of HBM chips, are in demand.

Samsung is likewise in communication with material makers, including Japan's Nagase, to source MUF materials, one source said, adding large-scale manufacturing of the very good quality chips utilizing MUF is probably not going to be prepared until the following year at the earliest, as Samsung require to run more tests.