US NSF inks $50mn pact with Ericsson, IBM, Intel, Samsung for chip design By CIOTechOutlook Team

US NSF inks $50mn pact with Ericsson, IBM, Intel, Samsung for chip design

CIOTechOutlook Team | Tuesday, 31 January 2023, 08:40 IST

The next-generation semiconductor design will be supported by a $50 million agreement inked by Ericsson, IBM, Intel, and Samsung, according to the US National Science Foundation (NSF).

In a blog post by NSF, this collaboration is a part of the organization's "Future of Semiconductors" (FuSe) strategy.

Through this partnership activity, NSF will collaborate with Ericsson, IBM, Intel and Samsung to fund projects that "cultivate a broad coalition of science and engineering researchers to pursue holistic, co-design approaches."

"Future semiconductors and microelectronics will require transdisciplinary research spanning materials, devices, and systems, as well as the engagement of the full spectrum of talent in the academic and industrial sectors," said Sethuraman Panchanathan, NSF director.

"Partnerships such as this are essential to inform research needs, spur innovation, accelerate the translation of results to the market, and prepare the future workforce," Panchanathan added.

The new technology is developed in an integrated manner by assisting researchers who are integrating materials, devices, structures, systems, and applications.

"Co-design approaches simultaneously consider the device/system performance, manufacturability, recyclability and impact on the environment," NSF mentioned.

The global pandemic and widespread semiconductor shortage have made it difficult for the chip industry to keep up with the increased demand for chip-based products.

Even though there is a large demand for chips in the US, only about 10% of the world's supply is made there.

"Investments through this public-private partnership will help address this problem by spurring research and innovation leading to breakthroughs in semiconductor and microelectronics technologies, aiding the myriad applications that rely upon these devices," NSF said.

"This partnership expands upon recent NSF investments to train and build a diverse semiconductor manufacturing workforce in the US," it added.